Electromigration performance of Pb-free solder joints in terms of solder composition and joining path

Author： Seo Sun-Kyoung   Kang Sung   Cho Moon   Lee Hyuck  

Publisher： Springer Publishing Company

ISSN： 1543-1851

Source： JOM, Vol.62, Iss.7, 2010-07, pp. : 22-29

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

High-cycle fatigue testing of Pb-free solder joints

By Barry N.   Jones I.P.   Hirst T.   Fox I.M.   Robins J.  

Soldering & Surface Mount Technology, Vol. 19, Iss. 2, 2007-04 ,pp. : 29-38

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Research Summary: Electromigration in Solder Joints and Solder Lines

By Gan H.   Choi W.J.   Xu G.   Tu K.N.  

JOM, Vol. 54, Iss. 6, 2002-06 ,pp. : 34-37

Springer Publishing Company

Access to resources Recommend Favorite

Pb-free solder bumping for flip chip package by electroplating

By Hwang Hyeon   Hong Soon-Min   Jung Jae-Pil   Kang Choon-Sik  

Soldering & Surface Mount Technology, Vol. 15, Iss. 2, 2003-06 ,pp. : 10-16

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Measuring the mechanical properties of Pb-free solder and Sn-based intermetallics by nanoindentation

By Chromik R.   Vinci R.   Allen S.   Notis M.  

JOM, Vol. 55, Iss. 6, 2003-06 ,pp. : 66-69

Springer Publishing Company

Access to resources Recommend Favorite

Effects of thermal history on the intermetallic growth and mechanical strength of Pb-free and Sn-Pb BGA solder balls

By Liang J.   Dariavach N.   Callahan P.   Shangguan D.  

Soldering & Surface Mount Technology, Vol. 19, Iss. 1, 2007-02 ,pp. : 4-14

Emerald Group Publishing Ltd

Access to resources Recommend Favorite