Thermal Properties and Interfacial Reaction between the Sn-9Zn-xAg Lead-Free Solders and Cu Substrate

Author： Chang Tao-Chih   Wang Moo-Chin   Hon Min-Hsiung  

Publisher： Springer Publishing Company

ISSN： 1543-1940

Source： Metallurgical and Materials Transactions A, Vol.36, Iss.11, 2005-11, pp. : 3019-3029

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

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