Characterization of local strain/stress in copper through-silicon via structures using synchrotron x-ray microdiffraction, electron backscattered diffraction and nonlinear thermomechanical model

Publisher： IOP Publishing

E-ISSN： 1361-6439|25|8|85002-85015

ISSN： 0960-1317

Source： Journal of Micromechanics and Microengineering, Vol.25, Iss.8, 2015-01, pp. : 85002-85015

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