Packaging using hot-embossing with a polymeric intermediate mould

Author： Khan Malek Chantal   Duffait Roland  

Publisher： Springer Publishing Company

ISSN： 0268-3768

Source： The International Journal of Advanced Manufacturing Technology, Vol.33, Iss.1-2, 2007-05, pp. : 187-190

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

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