Polymer circuit boards fabricated by ultrasonic hot embossing

Author： Gerhardy C   Schomburg W K   Li J  

Publisher： IOP Publishing

ISSN： 0960-1317

Source： Journal of Micromechanics and Microengineering, Vol.23, Iss.7, 2013-07, pp. : 75028-75032

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Ultrasonic Hot Embossing

By Schomburg Werner Karl   Burlage Katharina   Gerhardy Christof  

Micromachines, Vol. 2, Iss. 2, 2011-05 ,pp. : 157-166

MDPI

Access to resources Recommend Favorite

Polymeric microlens array fabricated with PDMS mold-based hot embossing

By Liu Yongshun   Zhang Ping   Deng Yongbo   Hao Peng   Fan Jianhua   Chi Mingbo   Wu Yihui  

Journal of Micromechanics and Microengineering, Vol. 24, Iss. 9, 2014-09 ,pp. : 95028-95035

IOP Publishing

Access to resources Recommend Favorite

Hot embossing of photonic crystal polymer structures with a high aspect ratio

By Schelb Mauno   Vannahme Christoph   Kolew Alexander   Mappes Timo  

Journal of Micromechanics and Microengineering, Vol. 21, Iss. 2, 2011-02 ,pp. : 25017-25021

IOP Publishing

Access to resources Recommend Favorite

Fabrication of 2D polymer nanochannels by sidewall lithography and hot embossing

By Cheng E   Zou Helin   Yin Zhifu   Jurčíček Petr   Zhang Xi  

Journal of Micromechanics and Microengineering, Vol. 23, Iss. 7, 2013-07 ,pp. : 75022-75029

IOP Publishing

Access to resources Recommend Favorite

Two dimensional PMMA nanofluidic device fabricated by hot embossing and oxygen plasma assisted thermal bonding methods

By Yin Zhifu   Sun Lei   Zou Helin   Cheng E  

Nanotechnology, Vol. 26, Iss. 21, 2015-05 ,pp. : 215302-215313

IOP Publishing

Access to resources Recommend Favorite