Comparison of bonding procedures for 3D-structured polyimide films on silicon substrates applied to ink-jet cartridges

Author： Goettsche T.   Ruddy C.   Heller U.   Stehr M.   Ashauer H.   Lindemann T.   Koltay P.   Yu Y.   Peters R.-P.   Soriani P.   Bellone A.  

Publisher： Springer Publishing Company

ISSN： 0268-3768

Source： The International Journal of Advanced Manufacturing Technology, Vol.33, Iss.1-2, 2007-05, pp. : 191-197

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