A new weakly alkaline slurry for copper planarization at a reduced down pressure

Author： Rui Chen   Jin Kang   Yuling Liu   Chenwei Wang   Ting Cai   Xin Li  

Publisher： IOP Publishing

ISSN： 1674-4926

Source： Journal of Semiconductors, Vol.35, Iss.2, 2014-02, pp. : 26005-26008

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