

Author: Minmin Fan Jingping Xu Lu Liu Yurong Bai
Publisher: IOP Publishing
ISSN: 1674-4926
Source: Journal of Semiconductors, Vol.35, Iss.4, 2014-04, pp. : 44004-44009
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Related content










Nickel-based contact metallization for SiGe MOSFETs: progress and challenges
By Zhang S.-L.
Microelectronic Engineering, Vol. 70, Iss. 2, 2003-11 ,pp. :