Related content

Interfacial reaction of a Sn-3.0Ag-0.5Cu thin film during solder reflow

By Lee Liu Mei   Haliman Habsah   Mohamad Ahmad Azmin  

Soldering & Surface Mount Technology, Vol. 25, Iss. 1, 2013-02 ,pp. : 15-23

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Formation behaviour of reaction layer in Sn-3.0Ag-0.5Cu solder joint with addition of porous Cu interlayer

By  

IOP Conference Series: Materials Science and Engineering, Vol. 61, Iss. 1, 2014-08 ,pp. : 139-144

IOP Publishing

Access to resources Recommend Favorite

Influence of Indium and Antimony Additions on Mechanical Properties and Microstructure of Sn-3.0Ag-0.5Cu Lead Free Solder Alloys

By  

Solid State Phenomena, Vol. 2017, Iss. 266, 2017-11 ,pp. : 196-200

Trans Tech Publications

Access to resources Recommend Favorite

Microstructure investigation of Sn-0.5Cu-3.5Ag and Sn-3.5Ag-0.5Cu-0.5B lead-free solders

By Ye L.   Lai Z.H.   Liu J.   Thölén A.  

Soldering & Surface Mount Technology, Vol. 13, Iss. 3, 2001-12 ,pp. : 16-20

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Coffin-Manson equation of Sn-4.0Ag-0.5Cu solder joint

By Chen S.   Sun P.   Wei X.C.   Cheng Z.N.   Liu J.  

Soldering & Surface Mount Technology, Vol. 21, Iss. 2, 2009-04 ,pp. : 48-54

Emerald Group Publishing Ltd

Access to resources Recommend Favorite