Zn diffusion and reflow behaviour of Sn-9Zn and Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga solders on a Ni/Cu substrate under IR reflow

Author： Mittal J.   Lin K.L.  

Publisher： Emerald Group Publishing Ltd

ISSN： 0954-0911

Source： Soldering & Surface Mount Technology, Vol.26, Iss.2, 2014-04, pp. : 87-95

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Related content

Effects of reflow on the interfacial characteristics between Zn nanoparticles containing Sn-3.8Ag-0.7Cu solder and copper substrate

By Chan Y.H.   Arafat M.M.   Haseeb A.S.M.A.  

Soldering & Surface Mount Technology, Vol. 25, Iss. 2, 2013-04 ,pp. : 91-98

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Improving high-temperature oxidation behaviour of Sn-Zn-Ag-Al-Ga solders

By Yeh T.K.   Lin K.L.   Salam B.  

Soldering & Surface Mount Technology, Vol. 21, Iss. 4, 2009-09 ,pp. : 19-23

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Thermal Properties and Interfacial Reaction between the Sn-9Zn-xAg Lead-Free Solders and Cu Substrate

By Chang Tao-Chih   Wang Moo-Chin   Hon Min-Hsiung  

Metallurgical and Materials Transactions A, Vol. 36, Iss. 11, 2005-11 ,pp. : 3019-3029

Springer Publishing Company

Access to resources Recommend Favorite

Effect of Thermal Aging on the Interfacial of Sn-Zn and Sn-Zn-Bi Solders Joint on Cu Substrate

By  

Key Engineering Materials, Vol. 2016, Iss. 700, 2016-08 ,pp. : 113-122

Trans Tech Publications

Access to resources Recommend Favorite

Effect of Cu and Ni Addition on Microstructure and Wettability of Sn-Zn Solders

By  

Key Engineering Materials, Vol. 2017, Iss. 728, 2017-03 ,pp. : 9-14

Trans Tech Publications

Access to resources Recommend Favorite