Post-ion beam induced degradation of copper layers in transmission electron microscopy specimens

Author: Seidel F   Richard O   Bender H   Vandervorst W  

Publisher: IOP Publishing

E-ISSN: 1361-6641|30|11|114016-114021

ISSN: 0268-1242

Source: Semiconductor Science and Technology, Vol.30, Iss.11, 2015-11, pp. : 114016-114021

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