Wafer-level Cu–Sn micro-joints with high mechanical strength and low Sn overflow

Author： Duan Ani   Luu Thi-Thuy   Wang Kaiying   Aasmundtveit Knut   Hoivik Nils  

Publisher： IOP Publishing

E-ISSN： 1361-6439|25|9|97001-97005

ISSN： 0960-1317

Source： Journal of Micromechanics and Microengineering, Vol.25, Iss.9, 2015-09, pp. : 97001-97005

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