Creep Characteristic of Sn1.0Ag0.7Cu Lead-Free Solders with Element Addition

Publisher： Trans Tech Publications

E-ISSN： 1662-7482|2016|853|192-196

ISSN： 1660-9336

Source： Applied Mechanics and Materials, Vol.2016, Iss.853, 2017-01, pp. : 192-196

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