Wafer-Level Packaging Method for RF MEMS Applications Using Pre-Patterned BCB Polymer

By Gong Zhuhao   Zhang Yulong   Guo Xin   Liu Zewen  

Micromachines, Vol. 9, Iss. 3, 2018-02 ,pp. : 93-93

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Wafer-Level Hybrid Integration of Complex Micro-Optical Modules

By Dannberg Peter   Wippermann Frank   Brückner Andreas   Matthes Andre   Schreiber Peter   Bräuer Andreas  

Micromachines, Vol. 5, Iss. 2, 2014-06 ,pp. : 325-340

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Cost-Efficient Wafer-Level Capping for MEMS and Imaging Sensors by Adhesive Wafer Bonding

By Bleiker Simon J.   Visser Taklo Maaike M.   Lietaer Nicolas   Vogl Andreas   Bakke Thor   Niklaus Frank  

Micromachines, Vol. 7, Iss. 10, 2016-10 ,pp. : 192-192

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Investigation of Surface Pre-Treatment Methods for Wafer-Level Cu-Cu Thermo-Compression Bonding

By Tanaka Koki   Wang Wei-Shan   Baum Mario   Froemel Joerg   Hirano Hideki   Tanaka Shuji   Wiemer Maik   Otto Thomas  

Micromachines, Vol. 7, Iss. 12, 2016-12 ,pp. : 234-234

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Three-Dimensional Simulation of DRIE Process Based on the Narrow Band Level Set and Monte Carlo Method

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Micromachines, Vol. 9, Iss. 2, 2018-02 ,pp. : 74-74

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