Investigation of Surface Pre-Treatment Methods for Wafer-Level Cu-Cu Thermo-Compression Bonding

Author： Tanaka Koki Wang Wei-Shan Baum Mario Froemel Joerg Hirano Hideki Tanaka Shuji Wiemer Maik Otto Thomas

Publisher： MDPI

E-ISSN： 2072-666x|7|12|234-234

ISSN： 2072-666x

Source： Micromachines, Vol.7, Iss.12, 2016-12, pp. : 234-234

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