Investigation of the effect of indium addition on wettability of Sn-Ag-Cu solders

By Moser Z.   Fima P.   Bukat K.   Sitek J.   Pstrus J.   Gasior W.   Koscielski M.   Gancarz T.  

Soldering & Surface Mount Technology, Vol. 23, Iss. 1, 2011-02 ,pp. : 22-29

Emerald Group Publishing Ltd

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The effect of Pb contamination on the microstructure and mechanical properties of SnAg/Cu and SnSb/Cu solder joints in SMT

By Zhu Qinong   Sheng Mei   Luo Le  

Soldering & Surface Mount Technology, Vol. 12, Iss. 3, 2000-12 ,pp. : 19-24

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Effects of indium on the mechanical properties of ternary Sn-In-Ag solders

By Yeh M.  

Metallurgical and Materials Transactions A, Vol. 34, Iss. 2, 2003-02 ,pp. : 361-365

Springer Publishing Company

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Evaluation of the influence of Bi and Sb additions to Sn-Ag-Cu and Sn-Zn alloys on their surface tension and wetting properties using analysis of variance ‐ ANOVA

By Bukat K.   Sitek J.   Kisiel R.   Moser Z.   Gasior W.   Koscielski M.   Pstrus J.  

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Sn-Ag-Cu and Sn-Cu solders: Interfacial reactions with platinum

By Kim Tae   Kim Young-Ho  

JOM, Vol. 56, Iss. 6, 2004-06 ,pp. : 45-49

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