The Thermal-Aging Effect on the Microstructure Evolution and Shear Strength of the Sn-Rich Au-Sn Soldering between Altic and Si Substrate in Microelectronics

Publisher： Trans Tech Publications

E-ISSN： 1662-9795|2017|751|3-8

ISSN： 1013-9826

Source： Key Engineering Materials, Vol.2017, Iss.751, 2017-09, pp. : 3-8

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