Influence of Indium and Antimony Additions on Mechanical Properties and Microstructure of Sn-3.0Ag-0.5Cu Lead Free Solder Alloys

Publisher: Trans Tech Publications

E-ISSN: 1662-9779|2017|266|196-200

ISSN: 1012-0394

Source: Solid State Phenomena, Vol.2017, Iss.266, 2017-11, pp. : 196-200

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