Effect of minor additions of Fe on bulk alloy microstructure and tensile properties of the low Ag-content Sn-1Ag-0.5Cu solder alloy

By Shnawah Dhafer Abdul Ameer   Said Suhana Binti Mohd   Sabri Mohd Faizul Bin Mohd   Badruddin Irfan Anjum   Che Fa Xing  

Soldering & Surface Mount Technology, Vol. 24, Iss. 4, 2012-09 ,pp. : 257-266

Emerald Group Publishing Ltd

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Effect of crystallographic anisotropy of β-tin grains on thermal fatigue properties of Sn–1Ag–0˙5Cu and Sn–3Ag–0˙5Cu lead free solder interconnects

By Terashima S.   Kobayashi T.   Tanaka M.  

Science and Technology of Welding & Joining, Vol. 13, Iss. 8, 2008-11 ,pp. : 732-738

Maney Publishing

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Thermal fatigue properties and grain boundary character distribution in Sn–x Ag–0˙5Cu (x = 1, 1˙2 and 3) lead free solder interconnects

By Terashima S.   Tanaka M.   Tatsumi K.  

Science and Technology of Welding & Joining, Vol. 13, Iss. 1, 2008-01 ,pp. : 60-65

Maney Publishing

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Microstructure investigation of Sn-0.5Cu-3.5Ag and Sn-3.5Ag-0.5Cu-0.5B lead-free solders

By Ye L.   Lai Z.H.   Liu J.   Thölén A.  

Soldering & Surface Mount Technology, Vol. 13, Iss. 3, 2001-12 ,pp. : 16-20

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The effect of Pb contamination on the microstructure and mechanical properties of SnAg/Cu and SnSb/Cu solder joints in SMT

By Zhu Qinong   Sheng Mei   Luo Le  

Soldering & Surface Mount Technology, Vol. 12, Iss. 3, 2000-12 ,pp. : 19-24

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