An investigation of supercritical-CO2 copper electroplating parameters for application in TSV chips

E-ISSN： 1361-6439|25|1|15004-15014

ISSN： 0960-1317

Source： Journal of Micromechanics and Microengineering, Vol.25, Iss.1, 2015-01, pp. : 15004-15014

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