Integrated vapor pressure, hygroswelling, and thermo-mechanical stress modeling of QFN package during reflow with interfacial fracture mechanics analysis

Author： Tee T.Y.   Zhong Z.  

Publisher： Elsevier

ISSN： 0026-2714

Source： Microelectronics Reliability, Vol.44, Iss.1, 2004-01, pp. : 105-114

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Related content

Microstructure coarsening during thermo-mechanical fatigue of Pb-Sn solder joints

By Hacke P.   Sprecher A.   Conrad H.  

Journal of Electronic Materials, Vol. 26, Iss. 7, 1997-07 ,pp. : 774-782

Springer Publishing Company

Access to resources Recommend Favorite

A 4 × 2 switch matrix in QFN24 package for 0.5–3 GHz application

By  

Journal of Semiconductors, Vol. 35, Iss. 12, 2014-12 ,pp. : 125012-125016

IOP Publishing

Access to resources Recommend Favorite

Thermal and thermo-mechanical modelling of polymer overmoulded electronics

By Sarvar Farhad   Whalley David C.   Hutt David A.   Palmer Paul J.   Teh Nee Joo  

Microelectronics International, Vol. 24, Iss. 3, 2007-07 ,pp. : 66-75

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Popcorning in PBGA Packages During IR Reflow Soldering

By McCluskey P   Munamarty R   M.Pecht  

Microelectronics International, Vol. 14, Iss. 1, 1997-01 ,pp. : 20-23

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Analysis of warpage and residual stress in plastic ball grid array package after post mold cure

By Yi Sung   Lam Tatiana M.  

Microelectronics International, Vol. 29, Iss. 3, 2012-07 ,pp. : 163-171

Emerald Group Publishing Ltd

Access to resources Recommend Favorite