Copper post-electroplating anneal: evaluation of in-line vs. furnace anneal on layer properties

Author: Haumesser P.H.   Mourier T.   Maitrejean S.   Cordeau M.   Morel T.   Avale X.   Pollet O.   Klocke J.  

Publisher: Elsevier

ISSN: 0167-9317

Source: Microelectronic Engineering, Vol.70, Iss.2, 2003-11, pp. : 470-477

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