Material modification of the patterned wafer during dry etching and strip determined by XPS

Author: Furukawa Y.   Patz M.   Kokubo T.   Snijders J.H.M.  

Publisher: Elsevier

ISSN: 0167-9317

Source: Microelectronic Engineering, Vol.70, Iss.2, 2003-11, pp. : 267-273

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