Creep and fatigue behaviors of the lead-free Sn–Ag–Cu–Bi and Sn60Pb40 solder interconnections at elevated temperatures

By Zhang X.   Yu C.   Shrestha S.   Dorn L.  

Journal of Materials Science: Materials in Electronics, Vol. 18, Iss. 6, 2007-06 ,pp. : 665-670

Springer Publishing Company

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Electromigration issues in lead-free solder joints

By Chen Chih   Liang S.  

Journal of Materials Science: Materials in Electronics, Vol. 18, Iss. 1-3, 2007-03 ,pp. : 259-268

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Room-temperature indentation creep of lead-free Sn–Bi solder alloys

By Mahmudi R.   Geranmayeh A.   Mahmoodi S.   Khalatbari A.  

Journal of Materials Science: Materials in Electronics, Vol. 18, Iss. 10, 2007-10 ,pp. : 1071-1078

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Standardization of a shear test method for lead-free solder paste chip joints

By Choi Jai-Kyoung   Park Jai-Hyun   Ahn Yong-Sik  

Journal of Materials Science, Vol. 42, Iss. 17, 2007-09 ,pp. : 7451-7456

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Effect of intermetallic compounds on fracture behaviors of Sn3.0Ag0.5Cu lead-free solder joints during in situ tensile test

By Tian Yanhong  

Journal of Materials Science: Materials in Electronics, Vol. 23, Iss. 1, 2012-01 ,pp. : 136-147

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