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Elsevier

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The effect of low dielectric polymer thickness on the electromigration characteristics of Al(1% Cu-0.5% Si) thin films

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Characterization of pit morphology of sputtered Al-1wt.%Si-0.5wt.%Cu alloy thin film

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Directionality and Column Arrangement Principles of Precipitates in Al-Mg-Si-(Cu) and Al-Mg-Cu Linked to Line Defect in Al

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Evaluation of HfN thin films considered as diffusion barriers in the Al/HfN/Si system

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Thin Solid Films, Vol. 305, Iss. 1, 1997-08 ,pp. : 297-303

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