On the nitrogen and oxygen incorporation in plasma-enhanced chemical vapor deposition (PECVD) SiO x N y films

By Alayo M.I.   Pereyra I.   Scopel W.L.   Fantini M.C.A.  

Thin Solid Films, Vol. 402, Iss. 1, 2002-01 ,pp. : 154-161

Elsevier

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Thick SiO x N y and SiO 2 films obtained by PECVD technique at low temperatures

By Alayo M.I.   Pereyra I.   Carreno M.N.P.  

Thin Solid Films, Vol. 332, Iss. 1, 1998-11 ,pp. : 40-45

Elsevier

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Characterization of -Fe 2 O 3 thin films processed by plasma enhanced chemical vapor deposition (PECVD)

By Lee E.-T.   Kim B.-J.   Jang G.-E.  

Thin Solid Films, Vol. 341, Iss. 1, 1999-03 ,pp. : 73-78

Elsevier

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Direct observation of water incorporation in PECVD SiO 2 films by UV-Visible ellipsometry

By Vallee C.   Goullet A.   Granier A.  

Thin Solid Films, Vol. 311, Iss. 1, 1997-12 ,pp. : 212-217

Elsevier

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A comparative study on the nucleation and growth of ECR-PECVD PLZT ((Pb,La)(Zr,Ti)O 3 ) thin films on Pt/SiO 2 /Si substrates and on Pt/Ti/SiO 2 /Si substrates

By Shin J.-S.   Lee W.-J.  

Thin Solid Films, Vol. 333, Iss. 1, 1998-11 ,pp. : 142-149

Elsevier

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