Increase of cleaning rate and reduction in global warming effect during C 4 F 8 O/O 2 remote plasma cleaning of silicon nitride by adding NO and N 2 O

Author： Oh C.H.   Lee N.-E.   Kim J.H.   Yeom G.Y.   Yoon S.S.   Kwon T.K.  

Publisher： Elsevier

ISSN： 0040-6090

Source： Thin Solid Films, Vol.435, Iss.1, 2003-07, pp. : 264-269

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