Thin film sputtered silicon for silicon wafer bonding applications

Author: Hurley R.E.   Gamble H.S.  

Publisher: Elsevier

ISSN: 0042-207X

Source: Vacuum, Vol.70, Iss.2, 2003-03, pp. : 131-140

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract