Effect of adding Ce on interfacial reactions between Sn–Ag solder and Cu

By Yoon Jeong-Won   Noh Bo-In   Choi Jung-Hyun   Jung Seung-Boo  

Journal of Materials Science: Materials in Electronics, Vol. 22, Iss. 7, 2011-07 ,pp. : 745-750

Springer Publishing Company

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Retarding intermetallic compounds growth of Zn high-temperature solder and Cu substrate by trace element addition

By Park S.   Nagao Shijo   Sugahara Tohru   Kim Keun-Soo   Suganuma Katsuaki  

Journal of Materials Science: Materials in Electronics, Vol. 24, Iss. 12, 2013-12 ,pp. : 4704-4712

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Correlation between interfacial microstructure and shear behavior of Sn–Ag–Cu solder ball joined with Sn–Zn–Bi paste

By Shih Po-Cheng   Lin Kwang-Lung  

Journal of Materials Science, Vol. 42, Iss. 8, 2007-04 ,pp. : 2574-2581

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Suppression of Cu 3 Sn and Kirkendall voids at Cu/Sn-3.5Ag solder joints by adding a small amount of Ge

By Yu Chun  

Journal of Materials Science: Materials in Electronics, Vol. 23, Iss. 1, 2012-01 ,pp. : 56-60

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Effect of isothermal aging on intermetallic compound layer growth at the interface between Sn-3.5Ag-0.75Cu solder and Cu substrate

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Journal of Materials Science, Vol. 39, Iss. 13, 2004-07 ,pp. : 4211-4217

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