Suppression of Cu 3 Sn and Kirkendall voids at Cu/Sn-3.5Ag solder joints by adding a small amount of Ge

By Yu Chun  

Journal of Materials Science: Materials in Electronics, Vol. 23, Iss. 1, 2012-01 ,pp. : 56-60

Springer Publishing Company

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Formation and behavior of Kirkendall voids within intermetallic layers of solder joints

By Kim Doosoo   Chang Jong-hyeon   Park Jungil   Pak James  

Journal of Materials Science: Materials in Electronics, Vol. 22, Iss. 7, 2011-07 ,pp. : 703-716

Springer Publishing Company

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Effect of isothermal aging on intermetallic compound layer growth at the interface between Sn-3.5Ag-0.75Cu solder and Cu substrate

By Yoon Jeong-Won   Jung Seung-Boo  

Journal of Materials Science, Vol. 39, Iss. 13, 2004-07 ,pp. : 4211-4217

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The morphology and kinetic evolution of intermetallic compounds at Sn-Ag-Cu solder/Cu and Sn-Ag-Cu-0.5Al 2 O 3 composite solder/Cu interface during soldering reaction

By Chang S.  

Journal of Materials Science: Materials in Electronics, Vol. 23, Iss. 1, 2012-01 ,pp. : 100-107

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Formation of Kirkendall Voids at Low and High Aging Temperature in the Sn-0.7Cu-1.0wt.%Si₃N₄/Cu Solder Joints

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Advanced Materials Research, Vol. 2015, Iss. 1107, 2015-07 ,pp. : 577-581

Trans Tech Publications

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