Fatigue Properties of BGA Solder Joints: A Comparison of Thermal and Power Cycle Tests*

By Albrecht H.-J.   Gamalski J  

Microelectronics International, Vol. 14, Iss. 3, 1997-03 ,pp. : 21-30

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

A review on effect of minor alloying elements on thermal cycling and drop impact reliability of low-Ag Sn-Ag-Cu solder joints

By Shnawah Dhafer Abdul Ameer   Sabri Mohd Faizul Bin Mohd   Badruddin Irfan Anjum   Said Suhana  

Microelectronics International, Vol. 29, Iss. 1, 2012-01 ,pp. : 47-57

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Effect of dissolution and intermetallic formation on the reliability of FC joints

By Kulojärvi Kari   Vuorinen Vesa   Kivilahti Jorma  

Microelectronics International, Vol. 15, Iss. 2, 1998-02 ,pp. : 20-24

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Effect of Al-Trace Width on the Electromigration Failure Time of Flip-Chip Solder Joints

By Liang S.  

Journal of Electronic Materials, Vol. 39, Iss. 10, 2010-10 ,pp. : 2316-2323

Springer Publishing Company

Access to resources Recommend Favorite

The effect of small additions of copper on the aging kinetics of the intermetallic layer and intermetallic particles of eutectic tin-silver solder joints

By Sigelko J.   Choi S.   Subramanian K.   Lucas J.  

Journal of Electronic Materials, Vol. 29, Iss. 11, 2000-11 ,pp. : 1307-1311

Springer Publishing Company

Access to resources Recommend Favorite