Placement of piezoelectric ceramic sensors in ultrasonic wire-bonding transducers

Author： Chu P.W.-P.   Chong C.-P.   Chan H.L.-W.   Ng K.M.-W.   Liu P.C.-K.  

Publisher： Elsevier

ISSN： 0167-9317

Source： Microelectronic Engineering, Vol.66, Iss.1, 2003-04, pp. : 750-759

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