Author： Sengupta D.K. Fang W Malin J.I. Curtis A.P. Horton T. Kuo H.C. Turnbull D. Lin C.H. Li J. Hsieh K.C. Chuang S.L. Adesida I. Feng M. Bishop S.G Stillman G.E. Gibson J.M. Chen H. Mazumder J. Liu H.C.
Publisher： Springer Publishing Company
ISSN： 1543-186X
Source： Journal of Electronic Materials, Vol.26, Iss.1, 1997-12, pp. : 43-51
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