Influence of Dopant on Growth of Intermetallic Layers in Sn-Ag-Cu Solder Joints

By Li G.  

Journal of Electronic Materials, Vol. 40, Iss. 2, 2011-02 ,pp. : 165-175

Springer Publishing Company

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Cu 6 Sn 5 Morphology Transition and Its Effect on Mechanical Properties of Eutectic Sn-Ag Solder Joints

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Kinetics of Intermetallic Compound Formation at the Interface Between Sn-3.0Ag-0.5Cu Solder and Cu-Zn Alloy Substrates

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Journal of Electronic Materials, Vol. 39, Iss. 12, 2010-12 ,pp. : 2504-2512

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Au−Ni−Sn intermetallic phase relationships in eutectic Pb−Sn solder formed on Ni/Au metallization

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The effect of small additions of copper on the aging kinetics of the intermetallic layer and intermetallic particles of eutectic tin-silver solder joints

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