Evolution of grain structure in thin film reactions

Author: Barmak K.   Rickman J.   Michaelsen C.  

Publisher: Springer Publishing Company

ISSN: 1543-186X

Source: Journal of Electronic Materials, Vol.26, Iss.9, 1997-09, pp. : 1009-1020

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract