Effects of Ni Additions on the Growth of Cu 3 Sn in High-Lead Solders

Author: Wang Y.  

Publisher: Springer Publishing Company

ISSN: 1543-186X

Source: Journal of Electronic Materials, Vol.39, Iss.12, 2010-12, pp. : 2636-2642

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract