Author: Wang Y.
Publisher: Springer Publishing Company
ISSN: 1543-186X
Source: Journal of Electronic Materials, Vol.39, Iss.12, 2010-12, pp. : 2636-2642
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
Interaction Between Ni and Cu Across 95Pb-5Sn High-Lead Layer
By Chang C.C.
Journal of Electronic Materials, Vol. 39, Iss. 12, 2010-12 ,pp. :