Microstructural Variation and Phase Evolution in the Reaction of Sn- x Ag-Cu Solders and Cu- y Zn Substrates During Reflow

Author： Yu Chi-Yang

Publisher： Springer Publishing Company

ISSN： 1543-186X

Source： Journal of Electronic Materials, Vol.39, Iss.12, 2010-12, pp. : 2627-2635

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