Microstructural Variation and Phase Evolution in the Reaction of Sn- x Ag-Cu Solders and Cu- y Zn Substrates During Reflow

By Yu Chi-Yang  

Journal of Electronic Materials, Vol. 39, Iss. 12, 2010-12 ,pp. : 2627-2635

Springer Publishing Company

Access to resources Recommend Favorite

Effects of Zn-Containing Flux on Sn-3.5Ag Soldering with an Electroless Ni-P/Au Surface Finish: Microstructure and Wettability

By Sakurai Hitoshi  

Journal of Electronic Materials, Vol. 39, Iss. 12, 2010-12 ,pp. : 2598-2604

Springer Publishing Company

Access to resources Recommend Favorite

Study of the Effects of Zn Content on the Interfacial Reactions Between Sn-Zn Solders and Ni Substrates at 250°C

By Wang Chao-hong  

Journal of Electronic Materials, Vol. 39, Iss. 11, 2010-11 ,pp. : 2375-2381

Springer Publishing Company

Access to resources Recommend Favorite

Physical Properties of Sn 96.5 Ag 3.5 -Based Solders with Additions of Bi, Ge, and In

By Kaban I.  

Journal of Electronic Materials, Vol. 39, Iss. 1, 2010-01 ,pp. : 70-76

Springer Publishing Company

Access to resources Recommend Favorite

Comparative study of the dissolution kinetics of electrolytic Ni and electroless Ni-P by the molten Sn3.5Ag0.5Cu solder alloy

By Islam M.N.   Chan Y.C.   Sharif A.   Alam M.O.  

Microelectronics Reliability, Vol. 43, Iss. 12, 2003-12 ,pp. : 2031-2037

Elsevier

Access to resources Recommend Favorite