Author： Kim Sun-Sik
Publisher： Springer Publishing Company
ISSN： 1543-186X
Source： Journal of Electronic Materials, Vol.40, Iss.2, 2011-02, pp. : 232-238
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
By Bober B. Bochenek A. Olszewska-Mateja B. Zaluk Z.
Microelectronics International, Vol. 24, Iss. 1, 2007-01 ,pp. :
Access to resources
Recommend
Measurement of high electrical current density effects in solder joints
By Ye H. Hopkins D.C. Basaran C.
Microelectronics Reliability, Vol. 43, Iss. 12, 2003-12 ,pp. :