Effect of Solder Thickness on Electromigration Behavior in Eutectic SnPb Solder Reaction Couples

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Journal of Materials Engineering and Performance, Vol. 19, Iss. 5, 2010-07 ,pp. : 616-622

Springer Publishing Company

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Effects of thermal history on the intermetallic growth and mechanical strength of Pb-free and Sn-Pb BGA solder balls

By Liang J.   Dariavach N.   Callahan P.   Shangguan D.  

Soldering & Surface Mount Technology, Vol. 19, Iss. 1, 2007-02 ,pp. : 4-14

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Eutectic Sn/Pb solder bump and under bump metallurgy: interfacial reactions and adhesion

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Soldering & Surface Mount Technology, Vol. 10, Iss. 3, 1998-03 ,pp. : 29-37

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Experiments on the aging of Sn–Ag–Cu solder alloys

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Powder Metallurgy, Vol. 48, Iss. 2, 2005-06 ,pp. : 193-198

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Investigation of microstructural coarsening in Sn-Pb alloys

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