Failure analysis of lead-free solder joints for high-density packages

By Lau John   Shangguan Dongkai   Castello Todd   Horsley Rob   Smetana Joe   Hoo Nick   Dauksher Walter   Love Dave   Menis Irv   Sullivan Bob  

Soldering & Surface Mount Technology, Vol. 16, Iss. 2, 2004-08 ,pp. : 69-76

Emerald Group Publishing Ltd

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Design for lead-free solder joint reliability of high-density packages

By Lau John   Dauksher Walter   Smetana Joe   Horsley Rob   Shangguan Dongkai   Castello Todd   Menis Irv   Love Dave   Sullivan Bob  

Soldering & Surface Mount Technology, Vol. 16, Iss. 1, 2004-02 ,pp. : 12-26

Emerald Group Publishing Ltd

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Design, materials and process for lead-free assembly of high-density packages

By Smetana Joe   Horsley Rob   Lau John   Snowdon Ken   Shangguan Dongkai   Gleason Jerry   Memis Irv   Love Dave   Dauksher Walter   Sullivan Bob  

Soldering & Surface Mount Technology, Vol. 16, Iss. 1, 2004-02 ,pp. : 53-62

Emerald Group Publishing Ltd

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Thermal cycling reliability of lead-free chip resistor solder joints

By Suhling Jeffrey C.   Gale H.S.   Johnson R. Wayne   Islam M. Nokibul   Shete Tushar   Lall Pradeep   Bozack Michael J.   Evans John L.   Seto Ping   Gupta Tarun   Thompson James R.  

Soldering & Surface Mount Technology, Vol. 16, Iss. 2, 2004-08 ,pp. : 77-87

Emerald Group Publishing Ltd

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A study of thermo-mechanical reliability of lead-free PTH solder joints

By Nguyen Jennifer   Geiger David   Rooney Dan   Shangguan Dongkai  

Soldering & Surface Mount Technology, Vol. 21, Iss. 2, 2009-04 ,pp. : 39-47

Emerald Group Publishing Ltd

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