Effect of ENIG deposition on the failure mechanisms of thermomechanically loaded lead-free 2nd level interconnections in LTCC/PWB assemblies

By Nousiainen O.   Kangasvieri T.   Kautio K.   Rautioaho R.   Vähäkangas J.  

Soldering & Surface Mount Technology, Vol. 22, Iss. 3, 2010-01 ,pp. : 22-35

Emerald Group Publishing Ltd

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Enhanced thermal fatigue endurance and lifetime prediction of lead-free LGA joints in LTCC modules

By Nousiainen O.   Salmela O.   Putaala J.   Kangasvieri T.  

Soldering & Surface Mount Technology, Vol. 23, Iss. 2, 2011-04 ,pp. : 104-114

Emerald Group Publishing Ltd

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Thermal fatigue endurance of Sn3Ag0.5Cu0.5In0.05Ni and Sn2.5Ag0.8Cu0.5Sb solders in composite solder joints of LTCC/PWB assemblies

By Nousiainen O.   Kangasvieri T.   Rautioaho R.   Vähäkangas J.  

Soldering & Surface Mount Technology, Vol. 23, Iss. 1, 2011-02 ,pp. : 30-39

Emerald Group Publishing Ltd

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Lifetime prediction and design aspects of reliable lead-free non-collapsible BGA joints in LTCC packages for RF/microwave telecommunication applications

By Putaala Jussi   Salmela Olli   Nousiainen Olli   Kangasvieri Tero   Vähäkangas Jouko   Uusimäki Antti   Lappalainen Jyrki  

Soldering & Surface Mount Technology, Vol. 26, Iss. 3, 2014-05 ,pp. : 117-128

Emerald Group Publishing Ltd

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The effect of PCB surface finish on lead-free solder joints

By Nurmi Sami T   Sundelin Janne J   Ristolainen Eero O   Lepistö Toivo K  

Soldering & Surface Mount Technology, Vol. 17, Iss. 1, 2005-01 ,pp. : 13-23

Emerald Group Publishing Ltd

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