Lifetime prediction and design aspects of reliable lead-free non-collapsible BGA joints in LTCC packages for RF/microwave telecommunication applications

Author： Putaala Jussi   Salmela Olli   Nousiainen Olli   Kangasvieri Tero   Vähäkangas Jouko   Uusimäki Antti   Lappalainen Jyrki  

Publisher： Emerald Group Publishing Ltd

ISSN： 0954-0911

Source： Soldering & Surface Mount Technology, Vol.26, Iss.3, 2014-05, pp. : 117-128

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Related content

Enhanced thermal fatigue endurance and lifetime prediction of lead-free LGA joints in LTCC modules

By Nousiainen O.   Salmela O.   Putaala J.   Kangasvieri T.  

Soldering & Surface Mount Technology, Vol. 23, Iss. 2, 2011-04 ,pp. : 104-114

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Thermomechanically loaded lead-free LGA joints in LTCC/PWB assemblies

By Nousiainen Olli   Urhonen Timo   Kangasvieri Tero   Rautioaho Risto   Vähäkangas Jouko  

Soldering & Surface Mount Technology, Vol. 22, Iss. 2, 2010-01 ,pp. : 21-29

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Failure analysis of lead-free solder joints for high-density packages

By Lau John   Shangguan Dongkai   Castello Todd   Horsley Rob   Smetana Joe   Hoo Nick   Dauksher Walter   Love Dave   Menis Irv   Sullivan Bob  

Soldering & Surface Mount Technology, Vol. 16, Iss. 2, 2004-08 ,pp. : 69-76

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Design, materials and process for lead-free assembly of high-density packages

By Smetana Joe   Horsley Rob   Lau John   Snowdon Ken   Shangguan Dongkai   Gleason Jerry   Memis Irv   Love Dave   Dauksher Walter   Sullivan Bob  

Soldering & Surface Mount Technology, Vol. 16, Iss. 1, 2004-02 ,pp. : 53-62

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Design for lead-free solder joint reliability of high-density packages

By Lau John   Dauksher Walter   Smetana Joe   Horsley Rob   Shangguan Dongkai   Castello Todd   Menis Irv   Love Dave   Sullivan Bob  

Soldering & Surface Mount Technology, Vol. 16, Iss. 1, 2004-02 ,pp. : 12-26

Emerald Group Publishing Ltd

Access to resources Recommend Favorite