Thermomechanically loaded lead-free LGA joints in LTCC/PWB assemblies

By Nousiainen Olli   Urhonen Timo   Kangasvieri Tero   Rautioaho Risto   Vähäkangas Jouko  

Soldering & Surface Mount Technology, Vol. 22, Iss. 2, 2010-01 ,pp. : 21-29

Emerald Group Publishing Ltd

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Thermal fatigue endurance of Sn3Ag0.5Cu0.5In0.05Ni and Sn2.5Ag0.8Cu0.5Sb solders in composite solder joints of LTCC/PWB assemblies

By Nousiainen O.   Kangasvieri T.   Rautioaho R.   Vähäkangas J.  

Soldering & Surface Mount Technology, Vol. 23, Iss. 1, 2011-02 ,pp. : 30-39

Emerald Group Publishing Ltd

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Assessment of board level solder joint reliability for PBGA assemblies with lead-free solders

By Lee Shi-Wei Ricky   Lui Ben Hoi Wai   Kong Y.H.   Baylon Bernard   Leung Timothy   Umali Pompeo   Agtarap Hector  

Soldering & Surface Mount Technology, Vol. 14, Iss. 3, 2002-12 ,pp. : 46-50

Emerald Group Publishing Ltd

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Enhanced thermal fatigue endurance and lifetime prediction of lead-free LGA joints in LTCC modules

By Nousiainen O.   Salmela O.   Putaala J.   Kangasvieri T.  

Soldering & Surface Mount Technology, Vol. 23, Iss. 2, 2011-04 ,pp. : 104-114

Emerald Group Publishing Ltd

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Experimental investigation on the failure of lead-free solder joints under drop impact

By Liu Fang   Meng Guang   Zhao Mei  

Soldering & Surface Mount Technology, Vol. 22, Iss. 3, 2010-01 ,pp. : 36-41

Emerald Group Publishing Ltd

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