Failure analysis of lead-free solder joints for high-density packages

By Lau John   Shangguan Dongkai   Castello Todd   Horsley Rob   Smetana Joe   Hoo Nick   Dauksher Walter   Love Dave   Menis Irv   Sullivan Bob  

Soldering & Surface Mount Technology, Vol. 16, Iss. 2, 2004-08 ,pp. : 69-76

Emerald Group Publishing Ltd

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The impact of thermal cycling regime on the shear strength of lead-free solder joints

By Dusek Milos   Wickham Martin   Hunt Christopher  

Soldering & Surface Mount Technology, Vol. 17, Iss. 2, 2005-06 ,pp. : 22-31

Emerald Group Publishing Ltd

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A novel high speed impact testing method for evaluating the low temperature effects of eutectic and lead-free solder joints

By Liu De-Shin   Hsu Chang-Lin   Kuo Chia-Yuan   Huang Ya-Ling   Lin Kwang-Lung   Shen Geng-Shin  

Soldering & Surface Mount Technology, Vol. 24, Iss. 1, 2012-02 ,pp. : 22-29

Emerald Group Publishing Ltd

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The effect of PCB surface finish on lead-free solder joints

By Nurmi Sami T   Sundelin Janne J   Ristolainen Eero O   Lepistö Toivo K  

Soldering & Surface Mount Technology, Vol. 17, Iss. 1, 2005-01 ,pp. : 13-23

Emerald Group Publishing Ltd

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Thermal cycling reliability of lead-free chip resistor solder joints

By Suhling Jeffrey C.   Gale H.S.   Johnson R. Wayne   Islam M. Nokibul   Shete Tushar   Lall Pradeep   Bozack Michael J.   Evans John L.   Seto Ping   Gupta Tarun   Thompson James R.  

Soldering & Surface Mount Technology, Vol. 16, Iss. 2, 2004-08 ,pp. : 77-87

Emerald Group Publishing Ltd

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