Electrical evaluation of Cu contamination behavior at the backside surface of a thinned wafer by transient capacitance measurement

Author： Lee K-W Bea J-C Fukushima T Tanaka T Koyanagi M

Publisher： IOP Publishing

ISSN： 0268-1242

Source： Semiconductor Science and Technology, Vol.26, Iss.2, 2011-02, pp. : 25007-25010

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