Silicon-based wire electrode array for neural interfaces

By Pei Weihua   Zhao Hui   Zhao Shanshan   Fang Xiaolei   Chen Sanyuan   Gui Qiang   Tang Rongyu   Chen Yuanfang   Hong Bo   Gao Xiaorong   Chen Hongda  

Journal of Micromechanics and Microengineering, Vol. 24, Iss. 9, 2014-09 ,pp. : 95015-95022

IOP Publishing

Access to resources Recommend Favorite

A hermetic and room-temperature wafer bonding technique based on integrated reactive multilayer systems

By Braeuer J   Gessner T  

Journal of Micromechanics and Microengineering, Vol. 24, Iss. 11, 2014-11 ,pp. : 115002-115010

IOP Publishing

Access to resources Recommend Favorite

Room-Temperature Wafer Bonding of Silicon and Lithium Niobate by Means of Argon-Beam Surface Activation

By Takagi H.   Maeda R.   Suga T.  

Integrated Ferroelectrics, Vol. 50, Iss. 1, 2002-01 ,pp. : 53-59

Taylor & Francis Ltd

Access to resources Recommend Favorite

Wafer-level integration of NiTi shape memory alloy on silicon using Au–Si eutectic bonding

By Gradin Henrik   Bushra Sobia   Braun Stefan   Stemme Göran    

Journal of Micromechanics and Microengineering, Vol. 23, Iss. 1, 2013-01 ,pp. : 15008-15021

IOP Publishing

Access to resources Recommend Favorite

Voltage-assisted polymer wafer bonding

By Varsanik J S   Bernstein J J  

Journal of Micromechanics and Microengineering, Vol. 22, Iss. 2, 2012-02 ,pp. : 25004-25010

IOP Publishing

Access to resources Recommend Favorite