Changes in TCR of amorphous Ni–P resistive films as a function of thermal stabilization parameters

Author： Kowalik P.   Pruszowski Z.   Kulawik J.   Czerwinski Andrzej   Pluska Mariusz  

Publisher： Emerald Group Publishing Ltd

ISSN： 1356-5362

Source： Microelectronics International, Vol.31, Iss.3, 2014-07, pp. : 149-153

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