Impact of SiO₂ on Al–Al thermocompression wafer bonding

Author： Malik Nishant Schjølberg-Henriksen Kari Poppe Erik U Taklo Maaike M V Finstad Terje G

E-ISSN： 1361-6439|25|3|35025-35033

ISSN： 0960-1317

Source： Journal of Micromechanics and Microengineering, Vol.25, Iss.3, 2015-03, pp. : 35025-35033

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