Integration of laser die transfer and magnetic self-assembly for ultra-thin chip placement

Author： Berg Yuval   Tichem Marcel   Kotler Zvi   Berg Yuval  

Publisher： IOP Publishing

E-ISSN： 1361-6439|25|4|45008-45014

ISSN： 0960-1317

Source： Journal of Micromechanics and Microengineering, Vol.25, Iss.4, 2015-04, pp. : 45008-45014

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