A dicing-free SOI process for MEMS devices based on the lag effect

Author： Xie J   Hao Y   Shen Q   Chang H   Yuan W  

Publisher： IOP Publishing

ISSN： 0960-1317

Source： Journal of Micromechanics and Microengineering, Vol.23, Iss.12, 2013-12, pp. : 125033-125037

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